Multilayer circuit assemblies are made by stacking circuit panels having contacts on their top surfaces, through conductors extending between top and bottom surfaces and terminals connected to the bottomend of each through conductor. The terminals and contacts are arranged so that when the panels are...http://www.google.es/patents/US5282312?utm_source=gb-gplus-sharePatente US5282312 - Multi-layer circuit construction methods with customization features
Multi-layer circuit construction methods with customization features
