A sacrificial substrate for fabricating semiconductor device assemblies and packages with edge contacts includes conductive elements on a surface thereof, which are located so as to align along a street between each adjacent pair of semiconductor devices on the device substrate. A semiconductor device...http://www.google.es/patents/US7633159?utm_source=gb-gplus-sharePatente US7633159 - Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages
Semiconductor device assemblies and packages with edge contacts and ...
