A method of dividing a wafer having a plurality of areas, which are sectioned by the streets formed on the front surface in a lattice pattern and a plurality of devices, which are formed in the sectioned areas, along streets, the method comprising a first cutting step for holding the front surface of...http://www.google.es/patents/US7727810?utm_source=gb-gplus-sharePatente US7727810 - Wafer dividing method
