The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser, a substrate, and a tool. The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy within the substrate that alters the...http://www.google.es/patents/US20060049157?utm_source=gb-gplus-sharePatente US20060049157 - Heat treating assembly and method
Número de solicitud: 10/935,546 Número de publicación: US 2006/0049157 A1 Fecha de presentación: 7 Sep 2004 Patente emitida: US7259351 ( Fecha de emisión 21 Ago 2007)
