A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release...http://www.google.es/patents/US4521469?utm_source=gb-gplus-sharePatente US4521469 - Casing for electronic components
