In a process of fabricating flip chip interconnection, a UBM layer is deposited on an I/O pad of a chip. The UBM layer includes a nickel layer. On the UBM layer is formed a tin-containing solder material. The chip is mounted on a carrier substrate by alignment of the bonding pad with a contact pad of...http://www.google.es/patents/US6642079?utm_source=gb-gplus-sharePatente US6642079 - Process of fabricating flip chip interconnection structure
Process of fabricating flip chip interconnection structure
