A semiconductor die package is disclosed. The semiconductor die package includes a semiconductor die comprising an input at a first top semiconductor die surface and an output at a second bottom semiconductor die surface. A leadframe having a first leadframe surface and a second leadframe surface opposite...http://www.google.es/patents/US20090057852?utm_source=gb-gplus-sharePatente US20090057852 - THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
