The invention relates to a method for producing an integrated circuit comprising the following steps: preparing a semi-conductor substrate (1) with a contacting circuit area (SS); providing an insulating layer (IS) on the surface of the semi-conductor substrate (1): providing a contact hole (KL) in the...http://www.google.es/patents/US7084027?utm_source=gb-gplus-sharePatente US7084027 - Method for producing an integrated circuit
