An IC module includes a film substrate, a plurality of wiring leads, an electrically insulative plastic, and an IC chip. A junction structure of the IC module comprises the IC module, an electronic component, and an electrically conductive bonding compound to couple the IC module to the electronic component....http://www.google.es/patents/US5161009?utm_source=gb-gplus-sharePatente US5161009 - IC module having a folding junction structure
