Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an interface member having a die section attached to the die and an array section, and a casing encapsulating at...http://www.google.es/patents/US6560117?utm_source=gb-gplus-sharePatente US6560117 - Packaged microelectronic die assemblies and methods of manufacture
Packaged microelectronic die assemblies and methods of manufacture
