A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected...http://www.google.es/patents/US6684496?utm_source=gb-gplus-sharePatente US6684496 - Method of making an integrated circuit package
