A first semiconductor chip is produced by affixing a thermo-compression sheet to the back surface of a wafer having a circuit formed on its front surface. The first semiconductor chip is mounted on a circuit board including an insulating substrate and a wiring layer provided on the insulating substrate...http://www.google.es/patents/US6352879?utm_source=gb-gplus-sharePatente US6352879 - Semiconductor device and method of manufacturing the same
Semiconductor device and method of manufacturing the same
