Surface modifications of a mold used during semiconductor device fabrication provide non-stick characteristics and a mold surface that is resistant to abrasion or wear. Such surface modifications are particularly useful in a mold having a quartz planar surface adapted to contact a photocurable polymer...http://www.google.es/patents/US6523803?utm_source=gb-gplus-sharePatente US6523803 - Mold apparatus used during semiconductor device fabrication
Mold apparatus used during semiconductor device fabrication
