A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal pillar includes tapered sidewalls with...http://www.google.es/patents/US7319265?utm_source=gb-gplus-sharePatente US7319265 - Semiconductor chip assembly with precision-formed metal pillar
Semiconductor chip assembly with precision-formed metal pillar
