A semiconductor wafer includes a wafer body, a plurality of analog IC dies spacedly and alignedly formed on the wafer body to define a scribe line as a margin formed between each two dies wherein each of the dies has an internal circuit formed therewithin and at least a terminal pad formed along the...http://www.google.es/patents/US20050248000?utm_source=gb-gplus-sharePatente US20050248000 - Semiconductor wafer and manufacturing process thereof
Semiconductor wafer and manufacturing process thereof
Número de solicitud: 10/841,035 Número de publicación: US 2005/0248000 A1 Fecha de presentación: 6 May 2004 Patente emitida: US7075107 ( Fecha de emisión 11 Jul 2006)
