An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and...http://www.google.es/patents/US6875078?utm_source=gb-gplus-sharePatente US6875078 - Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
Apparatus and method for in-situ endpoint detection for chemical mechanical ...
