A method is described for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face...http://www.google.es/patents/US6004399?utm_source=gb-gplus-sharePatente US6004399 - Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers
Ultra-low particle semiconductor cleaner for removal of particle ...
