Thin and durable level-one and level-two integrated circuit packages are provided. Moisture-barriers may be provided to upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may be constructed with one or more metal layers to prevent warpage. These level-one...http://www.google.es/patents/US5446620?utm_source=gb-gplus-sharePatente US5446620 - Ultra high density integrated circuit packages
