A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. The...http://www.google.es/patents/US6257857?utm_source=gb-gplus-sharePatente US6257857 - Molding apparatus for flexible substrate based package
Molding apparatus for flexible substrate based package
