A chemical-mechanical polishing apparatus is provided that creates a uniform kinematical pattern on the surface of a wafer being polished. The apparatus may have a polishing pad comprising a polishing pad surface having a center point that lies within an axis of motion for the polishing pad and a plurality...http://www.google.es/patents/US7544115?utm_source=gb-gplus-sharePatente US7544115 - Chemical mechanical polishing assembly with altered polishing pad topographical components
Chemical mechanical polishing assembly with altered polishing pad ...
