A method for fabricating a lead frame that includes a platform attached thereto for mounting a chip. A base frame is provided for mounting chips of various sizes. The base frame includes connection leads extending toward a central portion, which is substantially of the size of the smallest chip to mount....http://www.google.es/patents/US6049971?utm_source=gb-gplus-sharePatente US6049971 - Casing for integrated circuit chips and method of fabrication
Casing for integrated circuit chips and method of fabrication
