According to a method of manufacturing a semiconductor device of this invention, a first lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads. A second lead frame portion has a bed portion for mounting a semiconductor element and a plurality...http://www.google.es/patents/US5543658?utm_source=gb-gplus-sharePatente US5543658 - Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device
Method of manufacturing resin-sealed semiconductor device, lead frame used ...
