The present invention discloses an improved method for carry out a flip chip packaging process for attaching a semiconductor integrated circuit (IC) wafer having a plurality of input/output terminals, to a substrate. The method includes the steps of: 1) securely placing a plurality of solder balls on...http://www.google.es/patents/US6369451?utm_source=gb-gplus-sharePatente US6369451 - Solder balls and columns with stratified underfills on substrate for flip chip joining
Solder balls and columns with stratified underfills on substrate for flip ...
