In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center...http://www.google.es/patents/US20030042844?utm_source=gb-gplus-sharePatente US20030042844 - LED device and manufacturing method thereof
Número de solicitud: 10/231,067 Número de publicación: US 2003/0042844 A1 Fecha de presentación: 30 Ago 2002 Patente emitida: US6812481 ( Fecha de emisión 2 Nov 2004)
