To test the soldering temperature on the upper surface of an electronic circuit ceramic substrate (16) that is conveyed on a moving belt (12) over a plurality of heater platens (10), a thermocouple (20) is yieldably pressed to the upper surface of the substrate by a pressing mechanism (22). The pressing...http://www.google.es/patents/US4515484?utm_source=gb-gplus-sharePatente US4515484 - Temperature testing apparatus for an electronic circuit substrate
Temperature testing apparatus for an electronic circuit substrate
