A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the glass frame, a build-up layer formed...http://www.google.es/patents/US7170152?utm_source=gb-gplus-sharePatente US7170152 - Wafer level semiconductor package with build-up layer and method for fabricating the same
Wafer level semiconductor package with build-up layer and method for ...
