A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred...http://www.google.es/patents/US6624046?utm_source=gb-gplus-sharePatente US6624046 - Three dimensional processor using transferred thin film circuits
Three dimensional processor using transferred thin film circuits
