An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die are available. The present invention includes the use of a movable arm with a portion that is positionable under a portion...http://www.google.es/patents/US6299057?utm_source=gb-gplus-sharePatente US6299057 - Apparatus and method of clamping semiconductor devices using sliding finger supports
Apparatus and method of clamping semiconductor devices using sliding finger ...
