A multichip module is provided. The multichip module comprises a rigid substrate including a core material and having an opening, a thin film fixed on an upper surface of the rigid substrate so as to be electrically connected to the rigid substrate and to close the opening, a first chip mounted on the...http://www.google.es/patents/US20020149098?utm_source=gb-gplus-sharePatente US20020149098 - Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
Multichip module having chips mounted on upper and under surfaces of a thin ...
Número de solicitud: 09/988,575 Número de publicación: US 2002/0149098 A1 Fecha de presentación: 20 Nov 2001 Patente emitida: US6693362 ( Fecha de emisión 17 Feb 2004)
