Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external...http://www.google.es/patents/US8111515?utm_source=gb-gplus-sharePatente US8111515 - Methods and apparatuses for transferring heat from stacked microfeature devices
Methods and apparatuses for transferring heat from stacked microfeature devices
