An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a pattern of leads cantilevered over the recess configured to electrically engage...http://www.google.es/patents/US6980017?utm_source=gb-gplus-sharePatente US6980017 - Test interconnect for bumped semiconductor components and method of fabrication
Test interconnect for bumped semiconductor components and method of fabrication
