A method and apparatus for making pad structures suitable for wirebonding and, optionally, also for solder-ball connections. Some embodiments include an electronics chip having a substrate with circuitry, a compliant electrically insulating layer deposited on at least a portion of the substrate, and...http://www.google.es/patents/US7262513?utm_source=gb-gplus-sharePatente US7262513 - Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
Apparatus and method extending flip-chip pad structures for wirebonding on ...
