In aspect, the present invention is directed to a method of modifying a circuit board having at least one Ball Grid Array (BGA). The method includes removing the via portion of the BGA pad from the circuit board to sever the connection between the via and the circuit, attaching the pad connector to the...http://www.google.es/patents/US5890284?utm_source=gb-gplus-sharePatente US5890284 - Method for modifying circuit having ball grid array interconnections
Method for modifying circuit having ball grid array interconnections
