A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external contacts formed as multi layered metal bumps that include a base layer, a bump layer, and a non-oxidizing...http://www.google.es/patents/US7550315?utm_source=gb-gplus-sharePatente US7550315 - Method for fabricating semiconductor package with multi-layer die contact and external contact
Method for fabricating semiconductor package with multi-layer die contact ...
