An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes...http://www.google.es/patents/US8168453?utm_source=gb-gplus-sharePatente US8168453 - Light emitting diode package and fabrication method thereof
Light emitting diode package and fabrication method thereof
