Space-efficient packaging of microelectronic devices permits greater functionality per unit PC board surface area. In certain embodiments, packages having leads of a reverse gull wing shape reduce peripheral footprint area occupied by the leads, thereby permitting maximum space in the package footprint...http://www.google.es/patents/US20030062601?utm_source=gb-gplus-sharePatente US20030062601 - Surface mount package
Número de solicitud: 09/895,478 Número de publicación: US 2003/0062601 A1 Fecha de presentación: 29 Jun 2001 Patente emitida: US7057273 ( Fecha de emisión 6 Jun 2006)
