A flip-chip circuit arrangement having improved thermal management includes a base substrate having a top surface which includes one or more bond pads thereon. The arrangement further includes a semiconductor substrate having circuitry and one or more bond pads thereon, wherein the one or more bond pads...http://www.google.es/patents/US6278181?utm_source=gb-gplus-sharePatente US6278181 - Stacked multi-chip modules using C4 interconnect technology having improved thermal management
Stacked multi-chip modules using C4 interconnect technology having improved ...
