A method of minimizing warp and die stress in the production of an electronic assembly includes connecting one surface of a die to a package, and connecting an opposite surface of the die to a lid disposed over a constraining ring that is mounted to the package. The lid has a size, shape and coefficient...http://www.google.es/patents/US6027590?utm_source=gb-gplus-sharePatente US6027590 - Method for minimizing warp and die stress in the production of an electronic assembly
Method for minimizing warp and die stress in the production of an electronic ...
