A lead frame assembly including at least two layers. A first of the lead frame layers includes a first wide, electrically conductive bus and a plurality of leads that extend substantially unidirectionally from a single edge of the lead frame assembly. The second lead frame layer includes a second wide,...http://www.google.es/patents/US6717257?utm_source=gb-gplus-sharePatente US6717257 - Lead frame decoupling capacitor, semiconductor device packages including the same and methods
Lead frame decoupling capacitor, semiconductor device packages including the ...
