A method and apparatus for electrolytic plating of selected areas of printed circuit board traces is disclosed. The method is characterized by its elimination of the need for plating bus bars and plating contacts on the printed circuit board to facilitate a spot-plating process. In one embodiment, a...http://www.google.es/patents/US6632343?utm_source=gb-gplus-sharePatente US6632343 - Method and apparatus for electrolytic plating of surface metals
Method and apparatus for electrolytic plating of surface metals
