A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent...http://www.google.es/patents/US7164520?utm_source=gb-gplus-sharePatente US7164520 - Packaging for an interferometric modulator
