Pad-assisted electropolishing of the substrate is conducted by performing anodic dissolution of metal at a first portion of the substrate and simultaneously mechanically buffing a second portion of the substrate with a buffing pad. Anodic dissolution includes forming a thin liquid layer of electropolishing...http://www.google.es/patents/US7686935?utm_source=gb-gplus-sharePatente US7686935 - Pad-assisted electropolishing
