Disclosed are various embodiments of a method of forming vias for backside connections in a wafer stack, wherein the vias are formed by non-thermal laser ablation. Other embodiments are described an claimed....http://www.google.es/patents/US7118989?utm_source=gb-gplus-sharePatente US7118989 - Method of forming vias on a wafer stack using laser ablation
Method of forming vias on a wafer stack using laser ablation
