A heated air manifold of reduced physical dimensions for heating process air for use in dispensing heated liquids, such as hot melt adhesives. The heated air manifold includes at least one heating element and an air plenum having an air inlet and an air outlet. The dimensions of the air plenum are optimized...http://www.google.es/patents/US20030168180?utm_source=gb-gplus-sharePatente US20030168180 - Compact heated air manifolds for adhesive application
Compact heated air manifolds for adhesive application
Número de solicitud: 10/282,573 Número de publicación: US 2003/0168180 A1 Fecha de presentación: 29 Oct 2002 Patente emitida: US7617951 ( Fecha de emisión 17 Nov 2009)
