A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the...http://www.google.es/patents/US5950304?utm_source=gb-gplus-sharePatente US5950304 - Methods of making semiconductor chip assemblies
