A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second semiconductor device adjacent contact pads to a bottom side of the second device. Tower contact bumps are electrically...http://www.google.es/patents/US7605019?utm_source=gb-gplus-sharePatente US7605019 - Semiconductor device with stacked chips and method for manufacturing thereof
Semiconductor device with stacked chips and method for manufacturing thereof
