A multi-layered structure of wirings on a semiconductor substrate has been employed in conjunction with the increase in the integration density of semiconductor integrated circuit devices. In the invention, dummy patterns made of the same material as an Al wiring layer for compensating for any step or...http://www.google.es/patents/US5220199?utm_source=gb-gplus-sharePatente US5220199 - Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
Semiconductor integrated circuit device in which a semiconductor chip is ...
