An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining...http://www.google.es/patents/US5387762?utm_source=gb-gplus-sharePatente US5387762 - Resin-packaged electronic component having bent lead terminals
Resin-packaged electronic component having bent lead terminals
