Liquid nitrogen is introduced onto a surface of a semiconductor wafer to remove submicron particles from its surface. LN.sub.2 flows across the wafer surface wherein the surface tension of the liquid collects contaminant particles and removes them off the edge of the wafer....http://www.google.es/patents/US5555902?utm_source=gb-gplus-sharePatente US5555902 - Submicron particle removal using liquid nitrogen
