An electronic assembly includes an IC die including a semiconductor top surface having active circuitry thereon and a bottom surface, and at least one protruding bonding feature having sidewall surfaces and a leading edge surface extending outward from the IC die. A workpiece has a workpiece surface...http://www.google.es/patents/US8143704?utm_source=gb-gplus-sharePatente US8143704 - Electronic assemblies including mechanically secured protruding bonding conductor joints
Electronic assemblies including mechanically secured protruding bonding ...
